Intel Core Ultra 7 155U -vs- Intel Core Ultra 7 165U

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Specs comparison between Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

General specs comparisons between Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

General

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Intel Ultra 7 Ultra Series 1 Processor LogoIntel Ultra 7 Ultra Series 1 Processor Logo

Name

Intel Core Ultra 7 155UIntel Core Ultra 7 165U

Code Name

?An internal name used by the manufacturer during the development of a processor architecture. It often indicates the generation or specific design of the processor.
Intel Meteor Lake-HIntel Meteor Lake-H

Series

?The marketing name given to a specific family of processors within a brand's lineup, such as Intel Core i7 or AMD Ryzen 5. Series names help categorize processors based on performance and target market.
Intel Core Ultra Series 1 Intel Core Ultra Series 1 

Model Name

?The marketing name given to a specific family of CPUs within a brand's lineup, such as 'Intel Ultra 5' or 'Intel Ultra 7'. Model names help categorize CPUs based on performance and target market.
Intel Core Ultra 7Intel Core Ultra 7

Instruction set

?The set of commands that a processor understands and can execute. Different instruction sets support varying levels of performance and compatibility with software.
X86X86

Launch Date

12/202312/2023

Vertical

?The intended market segment or use case for the processor, such as desktop, laptop, server, or embedded systems. It indicates the processor's design and features tailored for specific applications.
LaptopLaptop
processors cpu comparisons between Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

CPU

Total No. of Core

?The total number of physical processing units within the processor. More cores allow the processor to handle multiple tasks simultaneously, enhancing multitasking performance.
1212

No. of P-Cores

?The number of Performance cores (P-cores) within the processor. P-cores are designed for high-performance tasks and demanding applications.
22

P-core Base Frequency

?The standard operating speed of the Performance cores (P-cores), measured in gigahertz (GHz). It indicates the P-cores' baseline performance level.
1.7 GHz1.7 GHz

P-Cores Boost Frequency

?The maximum speed a P-core can reach under heavy load, measured in gigahertz (GHz). It represents the P-cores' peak performance capability.
4.8 Ghz4.9 Ghz

No. of Ecore

?The number of Efficiency cores (E-cores) within the processor. E-cores are designed for power efficiency and handling background tasks.
88

Ecore Base Frequency

?The standard operating speed of the E-cores, measured in gigahertz (GHz). It indicates the E-cores' baseline performance level.
1.2 GHz1.2 GHz

ECores Boost Frequency

?The maximum speed an E-core can reach under heavy load, measured in gigahertz (GHz). It represents the E-cores' peak performance capability.
3.8 GHz3.8 GHz

No of LE-Cores

?The number of Low Energy cores (LE-cores) within the processor. LE-cores are designed for very low power consumption and handling extremely light tasks.
22

LE-Cores Base Frequency

?The standard operating speed of the LE-cores, measured in gigahertz (GHz). It indicates the LE-cores' baseline performance level.
0.7 GHz0.7 GHz

LE-Cores Boost Frequency

?The maximum speed an LE-core can reach under heavy load, measured in gigahertz (GHz). It represents the LE-cores' peak performance capability.
2.1 GHz2.1 GHz

No. of Threads

?The number of virtual processing units a core can handle simultaneously. Threads enable a single core to process multiple instruction streams, enhancing efficiency.
1414

L1 Cache

?The smallest and fastest cache memory level, located closest to the processor cores. It stores frequently accessed data for rapid retrieval.
112 KB (per core)112 KB (per core)

L2 Cache

?A mid-level cache memory that provides a larger storage capacity than L1 cache. It stores data that is less frequently accessed than L1 but more frequently than L3.
2 MB (per core)2 MB (per core)

L3 Cache

?The largest and slowest cache memory level shared by all processor cores. It stores data that is less frequently accessed than L2 but still needed for efficient operation.
12 MB (shared)12 MB (shared)

L1 Cache(E-core)

?The L1 cache memory dedicated to the Efficiency cores (E-cores). It stores frequently accessed data for rapid retrieval by the E-cores.
96 KB (per core)96 KB (per core)

L2 Cache(E-core)

?The L2 cache memory dedicated to the Efficiency cores (E-cores). It provides a larger storage capacity than the E-cores' L1 cache.
2 MB (per module)2 MB (per module)

Multiplier

?A factor that determines the processor's clock speed by multiplying the base clock frequency. It influences the overall operating speed of the processor.
17x17x

Unlocked Multiplier

?Indicates that the processor's multiplier can be adjusted, allowing for overclocking to increase performance beyond the default specifications.
NoNo
manufacturing technology and tdp comparisons between Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

Package

Technology

?The process used to create the processor, measured in nanometers (nm). Smaller manufacturing processes typically result in more efficient and powerful processors.
7 nm7 nm

Base Power Consumption

?The typical power consumption of the processor under normal operating conditions, measured in Watts (W). It indicates the processor's energy efficiency.
15 watt15 watt

Max. Power Consumption

?The maximum amount of power the processor can consume under heavy load, measured in Watts (W). It represents the processor's peak power usage.
57 watt57 watt

Socket

?The physical interface on the motherboard where the processor is installed. The socket type determines compatibility between the processor and motherboard.
FCBGA2049FCBGA2049

Max. Temperature

?The maximum safe operating temperature for the processor, measured in degrees Celsius (°C). Exceeding this temperature can lead to performance degradation or damage.
110°C110°C
comparison of igpu between Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

IGPU

IGPU Name

?The specific name given to the integrated Graphics Processing Unit (IGPU) by the processor manufacturer. It identifies the IGPU's architecture and capabilities.
Intel GraphicsIntel Graphics

Base Frequency

?The standard operating speed of the IGPU, measured in megahertz (MHz). It indicates the IGPU's baseline graphics processing power.
300 MHz300 MHz

Boost Frequency

?The maximum speed the IGPU can reach under heavy graphics load, measured in megahertz (MHz). It represents the IGPU's peak graphics performance.
1.95 GHz2 GHz

Shading Units

?The number of processing units within the IGPU responsible for rendering graphics. More shading units generally result in better graphics performance.
512512

TMUs

?Texture Mapping Units (TMUs) are processing units within the IGPU that apply textures to 3D surfaces. More TMUs improve the realism and detail of rendered graphics.
3232

ROPs

?Render Output Units (ROPs) are processing units within the IGPU that handle the final stage of rendering, converting pixel data into an image. More ROPs improve the frame rate and image quality.
1616

Execution Units

?The number of parallel processing cores within the IGPU. These units execute graphics instructions, and a higher number typically indicates better graphics performance.
6464

IGPU Perfomance

?The overall graphics processing capability of the integrated GPU. This is measured by how well it can handle graphical tasks, such as video playback and light gaming.
2 TFLOPS2.05 TFLOPS
npu comparison between Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

NPU

NPU Name

?The specific name given to the Neural Processing Unit (NPU) by the processor manufacturer. It identifies the NPU's architecture and AI processing capabilities.
Intel AI BoostIntel AI Boost

NPU TOPS

?The processing power of the NPU, measured by how fast it can perform AI and machine learning operations. Higher NPU performance leads to faster AI-powered features.
11 Tops11 Tops
display and memory comparison between Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

Display & Memory Support

Memory Support

?The types and speeds of RAM that the processor is compatible with. It specifies the maximum amount and speed of RAM that can be used with the processor.
Up to LPDDR5/x 7467 MT/s
Up to DDR5 5600 MT/s
Up to LPDDR5/x 7467 MT/s
Up to DDR5 5600 MT/s

Max. Display Resolution Support

?The highest resolution that the processor's integrated graphics or the processor in conjunction with a dedicated GPU can output to a display. It indicates the maximum visual fidelity the processor can support.
7680 x 4320 @ 60Hz7680 x 4320 @ 60Hz

Features

PCIe 4, Thr. Director, DL Boost, AI Boost, vPro Essen., MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, AVX2, AVX-VNNI, FMA3, SHAPCIe 4, Thr. Director, DL Boost, AI Boost, vPro Enterp., RPE, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, AVX2, AVX-VNNI, FMA3, SHA

Features

IntelIntel

“`html Network Interface Card (NIC) Performance Review – Targeting High-Throughput Environments Introduction and Overview This document analyzes the performance specifications and suitability of various Network Interface Cards (NICs) specifically geared towards high-throughput network environments. The target audience for this assessment includes system administrators, network engineers, and architects responsible for infrastructure design, data center operations, and high performance computing (HPC). Key Performance Indicators (KPIs) and Specifications 1. Bandwidth and Throughput a. Physical Layer and Interface Standards: 100 Gigabit Ethernet (100GbE): The preferred standard for modern high-performance deployments. Considerations: QSFP28 transceivers, cabling (e.g., multimode fiber, single-mode fiber with appropriate reach), and power consumption. 40 Gigabit Ethernet (40GbE): Still relevant, especially for legacy infrastructure or less demanding scenarios. QSFP+ transceivers and DAC cables. 25 Gigabit Ethernet (25GbE): A cost-effective option offering a good balance between performance and price, increasingly popular in hyperscale data centers. SFP28 transceivers. 10 Gigabit Ethernet (10GbE): Acceptable but becoming the bottleneck in many high-demand environments. Consider for low-budget and specific use cases. Still using SFP+ transceivers. b. Effective Throughput Testing: Jumbo Frames: Required for maximizing throughput, especially with higher bandwidth NICs. TCP/IP and UDP Throughput: Benchmark testing using tools like iperf and netperf to measure real-world performance under various load conditions. Observe latency and packet loss metrics. Multicast Performance Consider the NIC’s handling for multiple streams if multicast is used because is important for high-performance environments such as video streaming, financial data and any application with group communication needs. 2. CPU Offload Capabilities a. Hardware Offloading: TCP/IP Offload Engine (TOE): Essential for reducing CPU utilization; delegates TCP/IP processing to the NIC. Significant impact on server performance. RDMA (Remote Direct Memory Access): Crucial for low-latency, high-bandwidth scenarios (e.g., HPC, storage solutions). Consider InfiniBand (often with RDMA), RoCE (RDMA over Converged Ethernet), and iWARP (RDMA over TCP). Check what specific RDMA protocols the NIC, switches and servers support. Checksum Offload: Offloads IPv4, IPv6, and TCP/UDP checksum calculations. Segmentation Offload (TSO/GSO): Offloads TCP segmentation. Receive Side Scaling (RSS) and Receive Flow Steering (RFS): Ensure efficient packet distribution among CPU cores to increase CPU efficiency and performance. b. Vendor-Specific Implementations: Evaluate driver support, especially in different operating systems. Look for active community support as well. Verify driver stability and performance in production. 3. Power Consumption and Thermal Considerations a. Power Consumption: Wattage Rating: Choose NICs with the lowest power consumption compatible with the required performance to reduce operating costs and environmental impact. Power Management Features: Examine the NIC’s ability to dynamically adjust power consumption based on network load. b. Thermal Management: Heat Sink Design: Ensure appropriate heat sinks for the operating environment. Passive vs. active cooling (fan-equipped). Operating Temperature Range: Verify that the NIC can withstand the data center’s temperature conditions. 4. Latency and Packet Handling a. Latency Measurement: Microsecond or Nanosecond Level: Critical in applications demanding low latency. Performance impact must be evaluated with a ping measurement and performance monitoring software. Jitter and Variance: Analyze the consistency of latency to minimize performance bottlenecks. b. Hardware Packet Processing: Packet Buffering: Adequate buffer size is essential to handling burst traffic. Consider the impact on latency. Receive/Transmit Queues: Evaluate the number and size of packet queues, their effect on application performance. Vendor-Specific Recommendations This section is omitted as it varies with the specific vendors and hardware available at the time of evaluation. Always consult with vendor documentation and benchmarks for the most up-to-date specifications. Conclusion and Recommendations The selection of a high-performance NIC requires a thorough evaluation of KPIs like speed, bandwidth, resource offloading, and power consumption. The choice should be based on specific workload and be tailored to the environment. The optimal NIC solution is a trade-off between performance, cost, and operational consideration for the targeted application. “`

Laptops with Intel Core Ultra 7 155U and Intel Core Ultra 7 165U

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