AMD Ryzen Al Max+ PRO 395 -vs- AMD Ryzen AI 9 HX PRO 370
Related Processor
Compare Related Processor
Specs comparison between AMD Ryzen Al Max+ PRO 395 and AMD Ryzen AI 9 HX PRO 370
General | ||
|---|---|---|
Image |  |  |
Name | AMD Ryzen Al Max+ PRO 395 | AMD Ryzen AI 9 HX PRO 370 |
Code Name?An internal name used by the manufacturer during the development of a processor architecture. It often indicates the generation or specific design of the processor. | Zen 5 (Strix Halo) | Zen 5 (Strix Halo) |
Series?The marketing name given to a specific family of processors within a brand's lineup, such as Intel Core i7 or AMD Ryzen 5. Series names help categorize processors based on performance and target market. | AMD Ryzen AI Max PRO 300 | AMD Ryzen AI PRO 300 |
Model Name?The marketing name given to a specific family of CPUs within a brand's lineup, such as 'Intel Ultra 5' or 'Intel Ultra 7'. Model names help categorize CPUs based on performance and target market. | AI Max+ 395 | HX PRO 370 |
Instruction set?The set of commands that a processor understands and can execute. Different instruction sets support varying levels of performance and compatibility with software. | x86-64 | x86-65 |
Launch Date | 01/2025 | 01/2025 |
Vertical?The intended market segment or use case for the processor, such as desktop, laptop, server, or embedded systems. It indicates the processor's design and features tailored for specific applications. | Laptop | Laptop |
CPU | ||
|---|---|---|
Total No. of Core?The total number of physical processing units within the processor. More cores allow the processor to handle multiple tasks simultaneously, enhancing multitasking performance. | 16 | 12 |
No. of P-Cores?The number of Performance cores (P-cores) within the processor. P-cores are designed for high-performance tasks and demanding applications. | 16 | 4 |
P-core Base Frequency?The standard operating speed of the Performance cores (P-cores), measured in gigahertz (GHz). It indicates the P-cores' baseline performance level. | 3 GHz | 2 GHz |
P-Cores Boost Frequency?The maximum speed a P-core can reach under heavy load, measured in gigahertz (GHz). It represents the P-cores' peak performance capability. | 5.1 Ghz | 5.1 Ghz |
No. of Ecore?The number of Efficiency cores (E-cores) within the processor. E-cores are designed for power efficiency and handling background tasks. | 8 | |
Ecore Base Frequency?The standard operating speed of the E-cores, measured in gigahertz (GHz). It indicates the E-cores' baseline performance level. | 2 GHz | |
ECores Boost Frequency?The maximum speed an E-core can reach under heavy load, measured in gigahertz (GHz). It represents the E-cores' peak performance capability. | 3.3 GHz | |
No. of Threads?The number of virtual processing units a core can handle simultaneously. Threads enable a single core to process multiple instruction streams, enhancing efficiency. | 32 | 24 |
L1 Cache?The smallest and fastest cache memory level, located closest to the processor cores. It stores frequently accessed data for rapid retrieval. | 80KB (per core) | 80KB (per core) |
L2 Cache?A mid-level cache memory that provides a larger storage capacity than L1 cache. It stores data that is less frequently accessed than L1 but more frequently than L3. | 16 MB | 12 MB |
L3 Cache?The largest and slowest cache memory level shared by all processor cores. It stores data that is less frequently accessed than L2 but still needed for efficient operation. | 64 MB | 24 MB |
Multiplier?A factor that determines the processor's clock speed by multiplying the base clock frequency. It influences the overall operating speed of the processor. | 30x | 20x |
Unlocked Multiplier?Indicates that the processor's multiplier can be adjusted, allowing for overclocking to increase performance beyond the default specifications. | No | No |
Package | ||
|---|---|---|
Technology?The process used to create the processor, measured in nanometers (nm). Smaller manufacturing processes typically result in more efficient and powerful processors. | TSMC 4nm FinFET | TSMC 4nm FinFET |
Base Power Consumption?The typical power consumption of the processor under normal operating conditions, measured in Watts (W). It indicates the processor's energy efficiency. | 45 watt | 15 watt |
Max. Power Consumption?The maximum amount of power the processor can consume under heavy load, measured in Watts (W). It represents the processor's peak power usage. | 120 watt | 54 watt |
Socket?The physical interface on the motherboard where the processor is installed. The socket type determines compatibility between the processor and motherboard. | FP11 | FP8 |
Max. Temperature?The maximum safe operating temperature for the processor, measured in degrees Celsius (°C). Exceeding this temperature can lead to performance degradation or damage. | 100°C | 100 °C |
IGPU | ||
|---|---|---|
IGPU Name?The specific name given to the integrated Graphics Processing Unit (IGPU) by the processor manufacturer. It identifies the IGPU's architecture and capabilities. | AMD Radeon 890M | |
Boost Frequency?The maximum speed the IGPU can reach under heavy graphics load, measured in megahertz (MHz). It represents the IGPU's peak graphics performance. | 2900 MHz | 2900 MHz |
Shading Units?The number of processing units within the IGPU responsible for rendering graphics. More shading units generally result in better graphics performance. | 2560 | 1024 |
TMUs?Texture Mapping Units (TMUs) are processing units within the IGPU that apply textures to 3D surfaces. More TMUs improve the realism and detail of rendered graphics. | 160 | 64 |
ROPs?Render Output Units (ROPs) are processing units within the IGPU that handle the final stage of rendering, converting pixel data into an image. More ROPs improve the frame rate and image quality. | 80 | 32 |
Execution Units?The number of parallel processing cores within the IGPU. These units execute graphics instructions, and a higher number typically indicates better graphics performance. | 40 | 16 |
NPU | ||
|---|---|---|
NPU Name?The specific name given to the Neural Processing Unit (NPU) by the processor manufacturer. It identifies the NPU's architecture and AI processing capabilities. | AMD Ryzen AI | AMD Ryzen AI |
NPU TOPS?The processing power of the NPU, measured by how fast it can perform AI and machine learning operations. Higher NPU performance leads to faster AI-powered features. | 50 TOPS | 50 TOPS |
Display & Memory Support | ||
|---|---|---|
Memory Support?The types and speeds of RAM that the processor is compatible with. It specifies the maximum amount and speed of RAM that can be used with the processor. | LPDDR5x-8000 | DDR5-5600, LPDDR5x-8000 - 256 GB |
Max. Display Resolution Support?The highest resolution that the processor's integrated graphics or the processor in conjunction with a dedicated GPU can output to a display. It indicates the maximum visual fidelity the processor can support. | 7680x4320 @ 60Hz | 7680x4320 @ 60Hz |
Features | PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), AES , AMD-V , AVX , AVX2 , AVX512 , FMA3 , MMX-plus , SHA , SSE , SSE2 , SSE3 , SSE4.1 , SSE4.2 , SSE4A , SSSE3 , x86-64 |
Features | AMD | AMD |
AMD Ryzen AI Max+ PRO 395 vs. Ryzen AI 9 HX PRO 370: High-Performance AI Mobile Processors Compared
This article compares two high-performance mobile processors from AMD’s Zen 5 (Strix Halo) lineup: the Ryzen AI Max+ PRO 395 and the Ryzen AI 9 HX PRO 370. Both processors are designed with a strong focus on AI capabilities, but they differ in core counts, power consumption, and integrated graphics.
Key Specifications and Differences
The processors showcase differences in core counts, base frequency, power consumption, and integrated graphics performance.
AMD Ryzen AI Max+ PRO 395
Specifications:
- Architecture: Zen 5 (Strix Halo)
- Cores: 16
- Base Frequency: 3 GHz
- Boost Frequency: 5.1 GHz
- Manufacturing: TSMC 4nm FinFET
- TDP: 45-120W
- NPU: AMD Ryzen AI (50 TOPS)
- Memory: LPDDR5x-8000
- Socket: FP11
- Max Temp: 100°C
AMD Ryzen AI 9 HX PRO 370
Specifications:
- Architecture: Zen 5 (Strix Halo)
- Cores: 12
- Base Frequency: 2 GHz
- Boost Frequency: 5.1 GHz
- Manufacturing: TSMC 4nm FinFET
- TDP: 15-54W
- iGPU: AMD Radeon 890M (2900 MHz, 1024 Shaders, 64 TMUs, 32 ROPs)
- NPU: AMD Ryzen AI (50 TOPS)
- Memory: DDR5-5600, LPDDR5x-8000 (up to 256GB)
- Socket: FP8
- Max Temp: 100°C
Performance, Strengths, and Weaknesses
AMD Ryzen AI Max+ PRO 395
Strengths:
- Higher core count and base frequency for superior multi-threaded performance.
- Strong performance for demanding tasks.
- High memory bandwidth with LPDDR5x-8000 support.
Weaknesses:
- Higher power consumption.
- No dedicated integrated GPU listed.
AMD Ryzen AI 9 HX PRO 370
Strengths:
- Powerful integrated AMD Radeon 890M graphics.
- Lower power consumption.
- Support for both DDR5 and LPDDR5x memory.
Weaknesses:
- Lower core count and base frequency compared to the 395.
- Lower maximum power consumption.
Conclusion
The AMD Ryzen AI Max+ PRO 395 is designed for users who need maximum multi-threaded performance and strong general computing capabilities. Its higher core count and base frequency make it suitable for demanding tasks. The AMD Ryzen AI 9 HX PRO 370 is tailored for users who prioritize integrated graphics capabilities and lower power consumption. Its powerful Radeon 890M iGPU makes it ideal for gaming and graphics-intensive tasks. The choice between these processors depends on the user’s priorities. If raw CPU performance is paramount, the 395 is the better choice. If integrated graphics and lower power consumption are crucial, the 370 is the more suitable option.